Home / Products / Resistors / Chip Resistor - Surface Mount / TLM2BDR091FTD
Manufacturer Part Number | TLM2BDR091FTD |
---|---|
Future Part Number | FT-TLM2BDR091FTD |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | TLM, CGS |
TLM2BDR091FTD Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 91 mOhms |
Tolerance | ±1% |
Power (Watts) | 0.5W, 1/2W |
Composition | Metal Foil |
Features | Current Sense |
Temperature Coefficient | ±50ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | 1206 (3216 Metric) |
Supplier Device Package | 1206 |
Size / Dimension | 0.120" L x 0.061" W (3.05mm x 1.55mm) |
Height - Seated (Max) | 0.028" (0.70mm) |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TLM2BDR091FTD Weight | Contact Us |
Replacement Part Number | TLM2BDR091FTD-FT |
RMCP2512FT6R20
Stackpole Electronics Inc
RMCP2512FT6R80
Stackpole Electronics Inc
RMCP2512FT75K0
Stackpole Electronics Inc
RMCP2512FT7K50
Stackpole Electronics Inc
RMCP2512FT7K87
Stackpole Electronics Inc
RMCP2512FT8K06
Stackpole Electronics Inc
RMCP2512FT8K20
Stackpole Electronics Inc
RMCP2512FT8K25
Stackpole Electronics Inc
RMCP2512FT8R06
Stackpole Electronics Inc
RMCP2512FT8R45
Stackpole Electronics Inc
XC4010E-1PQ208C
Xilinx Inc.
A54SX32A-FGG256I
Microsemi Corporation
U1AFS250-FG256I
Microsemi Corporation
ICE40LP640-SWG16TR50
Lattice Semiconductor Corporation
EP4CE55F23C7N
Intel
LFXP6C-3QN208C
Lattice Semiconductor Corporation
LFX200EB-05F256C
Lattice Semiconductor Corporation
LFE2M50SE-6F484C
Lattice Semiconductor Corporation
EP3C40F324C8
Intel
EPF10K100EQC240-2
Intel