Home / Products / Integrated Circuits (ICs) / Memory / TC58BVG0S3HBAI4
Manufacturer Part Number | TC58BVG0S3HBAI4 |
---|---|
Future Part Number | FT-TC58BVG0S3HBAI4 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Benand™ |
TC58BVG0S3HBAI4 Status (Lifecycle) | In Stock |
Part Status | Active |
Memory Type | Non-Volatile |
Memory Format | FLASH |
Technology | FLASH - NAND (SLC) |
Memory Size | 1Gb (128M x 8) |
Clock Frequency | - |
Write Cycle Time - Word, Page | 25ns |
Access Time | 25ns |
Memory Interface | Parallel |
Voltage - Supply | 2.7V ~ 3.6V |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 63-VFBGA |
Supplier Device Package | 63-TFBGA (9x11) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TC58BVG0S3HBAI4 Weight | Contact Us |
Replacement Part Number | TC58BVG0S3HBAI4-FT |
W25Q32JVTCIQ TR
Winbond Electronics
W25Q64JVTCIQ
Winbond Electronics
W25Q64JVTCIQ TR
Winbond Electronics
W25Q128FVCIF
Winbond Electronics
W25Q128FVCIG
Winbond Electronics
W25Q128FVCIG TR
Winbond Electronics
W25Q128FVCIP
Winbond Electronics
W25Q128FVCJF
Winbond Electronics
W25Q128FVCJF TR
Winbond Electronics
W25Q128FVCJQ
Winbond Electronics
LFE2-12SE-6T144I
Lattice Semiconductor Corporation
XC2VP40-6FGG676C
Xilinx Inc.
XCV1600E-6FG900I
Xilinx Inc.
XC3S700A-4FGG484I
Xilinx Inc.
M1AFS600-2FGG484I
Microsemi Corporation
A42MX09-VQ100M
Microsemi Corporation
5SGXMA7K3F40C2
Intel
5SGSMD4E2H29C2L
Intel
LFE2-35E-6FN672I
Lattice Semiconductor Corporation
LCMXO2-7000ZE-1FG484C
Lattice Semiconductor Corporation