Home / Products / Capacitors / Ceramic Capacitors / CK45-R3FD101K-GRA
Manufacturer Part Number | CK45-R3FD101K-GRA |
---|---|
Future Part Number | FT-CK45-R3FD101K-GRA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CK45-RR |
CK45-R3FD101K-GRA Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 100pF |
Tolerance | ±10% |
Voltage - Rated | 3000V (3kV) |
Temperature Coefficient | R |
Operating Temperature | -25°C ~ 125°C |
Features | High Voltage, Low Dissipation Factor |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial, Disc |
Size / Dimension | 0.236" Dia (6.00mm) |
Height - Seated (Max) | 0.394" (10.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.295" (7.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CK45-R3FD101K-GRA Weight | Contact Us |
Replacement Part Number | CK45-R3FD101K-GRA-FT |
CK45-B3DD681KYGNA
TDK Corporation
CK45-B3DD681KYNNA
TDK Corporation
CK45-B3DD681KYVNA
TDK Corporation
CK45-B3FD101KYVNA
TDK Corporation
CK45-B3FD151KYGNA
TDK Corporation
CK45-B3FD151KYNNA
TDK Corporation
CK45-B3FD151KYVNA
TDK Corporation
CK45-B3FD152KYGNA
TDK Corporation
CK45-B3FD152KYVNA
TDK Corporation
CK45-B3FD221KYVNA
TDK Corporation
AT6010A-2AU
Microchip Technology
XC2VP50-5FF1517C
Xilinx Inc.
XA3S250E-4VQG100Q
Xilinx Inc.
XC7A50T-L1FGG484I
Xilinx Inc.
APA600-FGG256A
Microsemi Corporation
EP4CE30F23C8N
Intel
XC7K355T-2FFG901C
Xilinx Inc.
LFE2M20E-6FN256I
Lattice Semiconductor Corporation
5CGXFC7D6F31C7N
Intel
10AX066K3F40I2LG
Intel